For high quality printing, fine-line & fine-pitch on ceramic substrates, LTCC, PCB, WAFERS, GLASS, METAL, odd-form components, DCB & IMS. |
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For high quality printing, fine-line & fine-pitch on ceramic substrates, LTCC, PCB, WAFERS, GLASS, METAL, Odd-form components, DCB & IMS. |
Screen frames, thickness measurer and programmable hole metallization (PHM). |
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Lasers for ohmmic & functional trimming of resistors. Scribing, drilling & cutting of ceramic substrates. Marking, Cutting & Growing. |
Reflow soldering system for SMT, thick-film, DCB & IMS. Curing and drying of pastes in thick-film & SMT technology. |
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Fully automatic loading & unloading equipments for PCB and substrates. |
| Fully automatic systems for solar cells: Laser, Wafer sorter and Sprayer for prediffusion. |
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Automatic processing lines for substrates, automatic membrane keyboards assembly, screen printer for BGS rework, solid paste printer with heated screen/squeegees system, machine for bubble Ink-het head. |
