Reflow soldering system for IMS DCB Thick Film – RPC 1120

RPC 1120 Reflow soldering system for IMS DCB Thick FilmReflow soldering system special design for Thick Film, DCB (Direct Copper Bonding) and IMS (Insulated Metal Substrates).

Mod. RPC 1120F Belt-less conveyor for high temperature and direct heating transmission to the substrates used in:

  • THICK FILM
  • DCB (Direct Copper Bonding)
  • IMS (Insulated Metal Substrates)

Download AUREL RPC 1120 – RPC 1100F

Event & News

New Products