Dryer for thick film pastes - Curing adhesives, resins

Furnaces for thick film technology: drying of thick film pastes and curing of polimeric pastes, adhesives, resins.

Prior to being submitted to be firing process, substrates with screened-on inks/pastes must be predryed to evaporate the solvents. (more…)

OG500 Furnace for firing up to 600°C

The Aurel OG500 furnace is designed for the firing of the thick film pastes used in high volume production of hybrids, solar cell, glass sealing, power device on aluminium or steel. (more…)

RPC 1120 Reflow soldering system for IMS DCB Thick FilmReflow soldering system special design for Thick Film, DCB (Direct Copper Bonding) and IMS (Insulated Metal Substrates).

Mod. RPC 1120F Belt-less conveyor for high temperature and direct heating transmission to the substrates used in:

  • DCB (Direct Copper Bonding)
  • IMS (Insulated Metal Substrates)

Download AUREL RPC 1120 – RPC 1100F

AF5 Forced convection reflow soldering systemForced convection reflow soldering system AF SERIES. Models AF5B and AF8B are a new design reflow ovens for SMD with the introduction of all the improvements for LEAD FREE soldering technology.

High power for an excellent heating distribution and precision, Higher soldering temperature, better cooling system with the combination of Curtains-Fans-Chiller.

Air or Nitrogen. Conveyor with meshed Belt or Belt-Fingers.

Download AUREL AF5-AF8

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