Laser systems for scribing, cutting of ceramic substrates – ALS 200

ALS200 is a very high accuracy laser system that is designed for scribing, drilling and cutting of ceramic substrates for thin and thick film hybrid circuits up to 6”x6” (typical Al₂O₃ and AlN).

The system is equipped with double nozzle for an e automatic switching: one for cutting and one for scribing. ALS200 lasers are offered as basic system (with manual loading/unloading) or with optional modules from/to stack or cassette magazine for high volume production.

Applications

• Cutting
• Scribing
• Drilling

Control systems

• The machine is PC controlled and allows a great deal of flexibility on all functions
  Windows © Operating System
• Wide screen monitor and industrial keyboard
• Menù Program for cutting, drilling and scribing (linear and circular interpolation).
• Machine diagnostic
• Machine hood & lifting and locking safety switches
• Work recipes and data logging

Head

• One fixed head
• Motorized focus to adjust the Z-axis according to the substrate thickness.
• High resolution Camera for work area vision with cross-hair for manual alignment of the substrates

Laser source

• High power semi-sealed CO2 Laser 350-1000W type RF333
• Gas CO2 plasma tubes mounted on a frame with a granite plane to ensure high output power stability
• RF excitement technology, high peak power, high frequency modulation, compactness
• Factory service free with easy gas cartridge replacement
• Frequency and pulse width programmable and real-time controlled by the electronic control

Other options

• PRS Vision System for automatic substrate alignment
• Water chiller (stand alone)
• Exhaust aspiration and filtering
• Automatic loading/unloading system from magazine for substrate  up to 6”x6”, two stack magazines, one for loading, one for unloading

Specifications ALS200

Video ALS200

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